STSP 2.375 29 (XS2046591413)
Bond calculator and reference for STSP 2.375 29 issued by Singtel Group Treasury Pte. Ltd. maturing 2029. Live price, yield to maturity, spread, duration and the full cash-flow schedule in one place.
Bond details
- Issuer: Singtel Group Treasury Pte. Ltd. bonds
- Issuer ratings: Moody's: A1 / S&P: A+
- Coupon: 2.375%
- Coupon frequency: semiannual
- Maturity: 2029
- Structure: Bullet, Callable
- Day count: 30/360
- Settlement: T+2
- Face value: USD 1,000
- Minimum denomination: USD 200,000
- Governing law: UK
- Country of risk: Singapore
- Amount issued: USD 750,000,000
- Amount outstanding: USD 750,000,000
- ISIN: XS2046591413
- Ticker: STSP 2.375 29
Documents
What you can analyze
- Clean price and dirty price
- Yield, spread, duration and convexity
- Full coupon and cash-flow schedule
Frequently asked questions
What is the ISIN of the STSP 2.375 29 bond?
The ISIN is XS2046591413.
What coupon does STSP 2.375 29 pay?
STSP 2.375 29 pays a 2.375% coupon.
When does STSP 2.375 29 mature?
STSP 2.375 29 matures in 2029.
What currency is STSP 2.375 29 denominated in?
STSP 2.375 29 is denominated in USD.
Who issued STSP 2.375 29?
STSP 2.375 29 was issued by Singtel Group Treasury Pte. Ltd..
Where can I check the live price and yield of STSP 2.375 29?
BondTerminal's free bond calculator shows the live price, yield to maturity, spread, duration and full cash-flow schedule for STSP 2.375 29 (XS2046591413).
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