STSP 1.875 30 (XS2185867160)
Bond calculator and reference for STSP 1.875 30 issued by Singtel Group Treasury Pte. Ltd. maturing 2030. Live price, yield to maturity, spread, duration and the full cash-flow schedule in one place.
Bond details
- Issuer: Singtel Group Treasury Pte. Ltd. bonds
- Issuer ratings: Moody's: A1 / S&P: A+
- Coupon: 1.875%
- Coupon frequency: semiannual
- Maturity: 2030
- Structure: Bullet, Callable
- Day count: 30/360
- Settlement: T+2
- Face value: USD 1,000
- Minimum denomination: USD 200,000
- Governing law: UK
- Country of risk: Singapore
- Amount issued: USD 750,000,000
- Amount outstanding: USD 750,000,000
- ISIN: XS2185867160
- Ticker: STSP 1.875 30
Documents
What you can analyze
- Clean price and dirty price
- Yield, spread, duration and convexity
- Full coupon and cash-flow schedule
Frequently asked questions
What is the ISIN of the STSP 1.875 30 bond?
The ISIN is XS2185867160.
What coupon does STSP 1.875 30 pay?
STSP 1.875 30 pays a 1.875% coupon.
When does STSP 1.875 30 mature?
STSP 1.875 30 matures in 2030.
What currency is STSP 1.875 30 denominated in?
STSP 1.875 30 is denominated in USD.
Who issued STSP 1.875 30?
STSP 1.875 30 was issued by Singtel Group Treasury Pte. Ltd..
Where can I check the live price and yield of STSP 1.875 30?
BondTerminal's free bond calculator shows the live price, yield to maturity, spread, duration and full cash-flow schedule for STSP 1.875 30 (XS2185867160).
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